BLACK MAGIC PRO
/0 Commenti/in BLACK MAGIC per deposizione grafene e CNT, Nanotech /da DemoWafer-scale Deposition of Carbon Nanotubes and Graphene BM Pro · 4/6/12 inch Features Fast response heater, up to 300 °C/minute ramp rates Thermal CVD Plasma enhanced CVD Excellent reproducibility Closed loop infrared wafer temperature control Advanced Design Plasma with frequency and duty cycle control Optimized geometry for uniformity Control Automatic process control Easy recipe editing […]
Black Magic 2″ – R&D
/0 Commenti/in BLACK MAGIC per deposizione grafene e CNT, Nanotech /da DemoApplying this methodology, the deposition of thin films takes place by means of chemical reactions, in which the wafers are exposed to a gas mixture that reacts on the wafer surface. The process can also be plasma-enhanced
MOCVD – Planetary Reactor
/0 Commenti/in MOCVD /da DemoThe Planetary Reactor is based on the principle of a horizontal laminar flow reactor. The laminar flow principle ensures extremely precise transitions between different materials, and an unparalleled control over the deposition rates for films that are only a few atoms thick
QXP-8300 NVM
/0 Commenti/in ALD /da DemoThe Highest Deposition Rate with Excellent Composition Control and Conformality
QXP-8300 ALD System
/0 Commenti/in ALD /da DemoAtomic layer deposition is a process for manufacturing ultrathin films for semiconductor components and future non-semiconductor applications
QXP-8300 ALD System
/0 Commenti/in Sistemi CVD e ALD /da DemoDeposition systems for logic and memory Technologies
QXP-8300 ALD System
Product Features
- Simultaneous processing of 8 wafers in two ALD chambers with excellent station to station uniformity
- Up to 4 precursor sources: combination of patented TriJet® vaporizers and bubblers
- Isolated multi wafer processing with Close Coupled Showerhead® for efficient & uniform distribution of precursors and gases in short cycle time
- >12,000 wafers run per chamber between wet clean or preventive maintenance
- Applications: DRAM, Flash and Logic High k Dielectric and Metal
- Over 80 chambers in High Volume Manufacturing (HVM) running over 300,000 wafers per month
Benefits
- Mini-batch 300 mm system
- High throughput: 2 process chambers – 8 stations
- Low running cost: >$1M savings per year for 80 K wafers start per month
- Proven in HVM with >40 % lower CoO and >90 % uptime in semiconductor fabs
- Oxide and nitride films with >95 % step coverage in 100:1 AR structures at 1x nm device and beyond
PECVD direct loading system Depolab 200
/0 Commenti/in PECVD – ICPECVD /da DemoThe PECVD system Depolab 200 combines cost effective direct loading and parallel plate plasma source in a basic, compact design. The easy to use direct loading system enables user-friendly batch processing (with carrier or direct loading onto the substrate electrode). The clever PECVD system can be upgraded for enhanced performance on demand
PECVD loadlock system SI 500 PPD
/0 Commenti/in PECVD – ICPECVD /da DemoThe flexible PECVD system SI 500 PPD features a variety of standard plasma deposition processes. SiO2, SiNx, SiOxNy, and a-Si are deposited with capacitively coupled plasma.
2m Strumenti S.R.L.
Piazza Leonardo Sciascia, 5
00137 Roma Italy
Tel: +39 06 868 74 357
Fax: +39 06 868 95 241
Email: info@2mstrumenti.com
Pec : 2mstrumenti@2mstrumenti.legalmail.it
00137 Roma Italy
Tel: +39 06 868 74 357
Fax: +39 06 868 95 241
Email: info@2mstrumenti.com
Pec : 2mstrumenti@2mstrumenti.legalmail.it
Prossimi eventi
Non ci sono eventi in arrivo al momento.