Deposition systems for logic and memory Technologies
QXP-8300 ALD System
Product Features
Simultaneous processing of 8 wafers in two ALD chambers with excellent station to station uniformity
Up to 4 precursor sources: combination of patented TriJet® vaporizers and bubblers
Isolated multi wafer processing with Close Coupled Showerhead® for efficient & uniform distribution of precursors and gases in short cycle time
>12,000 wafers run per chamber between wet clean or preventive maintenance
Applications: DRAM, Flash and Logic High k Dielectric and Metal
Over 80 chambers in High Volume Manufacturing (HVM) running over 300,000 wafers per month
Benefits
Mini-batch 300 mm system
High throughput: 2 process chambers – 8 stations
Low running cost: >$1M savings per year for 80 K wafers start per month
Proven in HVM with >40 % lower CoO and >90 % uptime in semiconductor fabs
Oxide and nitride films with >95 % step coverage in 100:1 AR structures at 1x nm device and beyond
http://2mstrumenti.com/wp-content/uploads/2016/01/2mLOGOfinal.jpg00Demohttp://2mstrumenti.com/wp-content/uploads/2016/01/2mLOGOfinal.jpgDemo2016-02-23 11:27:552019-05-27 08:05:06QXP-8300 ALD System
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