deposition systems for logic and memory Technologies
Product Features
- Simultaneous processing of 8 wafers in two ALD chambers with excellent station to station uniformity
- Up to 4 precursor sources: combination of patented TriJet® vaporizers and bubblers
- Isolated multi wafer processing with Close Coupled Showerhead® for efficient & uniform distribution of precursors and gases in short cycle time
- >12,000 wafers run per chamber between wet clean or preventive maintenance
- Applications: DRAM, Flash and Logic High k Dielectric and Metal
- Over 80 chambers in High Volume Manufacturing (HVM) running over 300,000 wafers per month
Benefits:
- Mini-batch 300 mm system
- High throughput: 2 process chambers – 8 stations
- Low running cost: >$1M savings per year for 80 K wafers start per month
- Proven in HVM with >40 % lower CoO and >90 % uptime in semiconductor fabs
- Oxide and nitride films with >95 % step coverage in 100:1 AR structures at 1x nm device and beyond
QXP-8300 ALD System Punte ed accessori per AFM
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