Disc Grinder System
Pre-thin and polish your samples to reduce ion milling times and improve quality.
Dimple Grinder
Fast and reliable mechanical method of pre-thinning to near electron transparency to greatly reduce your ion milling times and uneven thinning
ION POLISHING SYSTEM
Precision ion polishing system for precise centering, control, and reproducibility of your milling process
Ultrasonic Cutter
Cut your brittle materials beyond the 3 mm transmission electron microscope (TEM) disc to accurately cut holes or unique shapes
Cross Section Kit
Ideal for preparing cross sectional transmission electron microscopy (XTEM) samples of semiconductor devices, thin films of various substrates, and composites
Cryoplunge 3 System
Semi-automated plunge freezing instrument