Ultrasonic Cutter

  • Quickly cut simple holes, unique shapes, or TEM discs from hard, brittle materials such as semiconductors, ceramics, and geological materials
  • Cut materials ranging in thickness from <40 µm to 5 mm utilizing a piezo-electric crystal driving a tubular cutting tool in a fine grain, boron carbide slurry
  • Minimize mechanical and thermal damage using manually tuned frequency driver to optimize cutting speed
  • Reduce edge chipping and sample damage with spring-loaded platform and magnetically held table to prevent lateral movement
  • Precisely center your site specific area with integrated stereo microscope and X,Y table

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