RIE plasma etcher SI 591 compact

With the SI 591 compact, a variety of chlorine and fluorine based plasma etching processes can be performed reproducibly with a vacuum load lock and fully computer controlled processing. The SI 591 compact is characterized by a small footprint and flexible design for RIE plasma etching, e.g. the SI 591 compact can be integrated into a cluster system.

Ilion II System

Ideal for low energy surface preparation for your SEM cross section viewing

PECS II System

Broad argon ion beam system designed to polish and coat samples for SEM imaging and analytical techniques

GP [CONCEPT]

TAILOR-MADE GLOVE BOX GP CONCEPT High performance purification glove box, modular and versatile  for products and/oroperator protection. <1ppm O2/H2O Tailor-made drawings made according to your requirements. BENEFIT Atmosphere <1pmm O2/H2O, with low gas consumption. Work in underpressure or overpressure. Automatically assisted management and parameters recording. Integration of any type of material. Tailor-made drawings according to […]