RIE plasma etcher

SI 591 compact

Process flexibility

The RIE etcher SI 591 compact facilitates a large number of chlorine and fluorine based plasma etching processes.

Small footprint and high modularity

SI 591 compact can be configured as single reactor or as cluster tool with cassette-to-cassette loading.

SENTECH control software

Our plasma etching tools include user-friendly powerful software with mimic GUI, parameter window, recipe editor, data logging, and user management.

The SI 591 compact stands for excellent process reproducibility and plasma etching process flexibility due to the vacuum loadlock and fully computer controlled plasma etching process conditions. Flexibility, modularity, and a small footprint are design characteristics of the SI 591 compact. Samples up to 200 mm diameter and carrier can be loaded. The SI 591 compact can be configured for through the wall operation or minimal footprint with multipleoptions.

Large diagnostic windows located at top electrode and reactor can easily accommodate the SENTECH laser interferometer or OES and RGA systems. Ellipsometer ports are available for process monitoring using SENTECH insitu ellipsometers.

The SI 591 compact combines the advantages of a parallel plate electrode design for RIE with the fully computer controlled etch process conditions of the loadlock system. The SI 591 compact can be configured for processing of a variety of materials. At SENTECH we offer different levels of automation ranging from vacuum cassette loading to one process chamber up to six port cluster with different etch and deposition modules targeted to high flexibility or high throughput. The SI 591 compact is available as process module on cluster configuration as well.